Preparation and application of Ni-V sputtering target
2022-08-24
Nickel vanadium sputtering target is to add vanadium into the nickel melt during the preparation of nickel vanadium alloy, so that the prepared alloy is more conducive to magnetron sputtering, which combines the advantages of nickel sputtering target and vanadium sputtering target With the progress of society and the development of semiconductor industry, the demand for nickel vanadium target materials in electronics, information, integrated circuit, display and other industries is increasing
Sputtering targets are mainly used in information storage, integrated circuit, display, automobile rearview mirror and other industries, mainly for magnetron sputtering of various thin film materials Magnetron sputtering is a method for preparing thin film materials. The ions generated by the ion source are accelerated to gather into a high-speed ion flow in a vacuum. The accelerated particle flow bombards the object surface of the film to be deposited. The ions exchange kinetic energy with the atoms on the object surface of the film to be deposited, and nano (or micro) films are deposited on the object surface of the film to be deposited The bombarded solid is the raw material of thin film deposition by sputtering, which is called sputtering target
In the fabrication of integrated circuits, pure gold is generally used as the surface conductive layer, but Ausi low melting point compounds are easily generated between gold and silicon wafers, resulting in weak bonding between gold and silicon. It is proposed to add a bonding layer on the surface of gold and silicon wafers, and pure nickel is commonly used as the bonding layer. However, diffusion will also form between the nickel layer and the gold conductive layer. Therefore, a barrier layer is required to prevent diffusion between the gold conductive layer and the nickel bonding layer The barrier layer needs to use a metal with high melting point and bear a large current density. The high-purity metal vanadium can meet this requirement. Therefore, nickel sputtering target, vanadium sputtering target and gold sputtering target are used in the production of integrated circuits
Nickel vanadium sputtering target is to add vanadium into the nickel melt during the preparation of nickel vanadium alloy, so that the prepared alloy is more conducive to magnetron sputtering. It combines the advantages of nickel sputtering target and vanadium sputtering target, and can complete the sputtering of nickel layer (bonding layer) and vanadium layer (barrier layer) at one time. Nickel vanadium alloy is non-magnetic, which is conducive to magnetron sputtering. In the electronic and information industry, it basically replaces the pure nickel sputtering target. Characteristics and application of nickel vanadium alloy target
Nickel vanadium alloy targets are mainly used in solar energy industry, electronic industry and other fields The application and required purity of nickel vanadium target are shown in Table 1
1) Optical storage
2) Solar thin film cell
3) Flat panel display coating
4) Electronic and semiconductor fields
5) Architectural glass
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