Nickel silicon (Nisi) is an austenitic (Nisi) alloy, which is used as the negative extreme material of n-type thermocouple. It has good thermoelectric stability above 1000 ° C and better oxidation resistance than e, J and K-type galvanic couples.
Nickel silicon alloy cannot be placed in sulfur-containing gas. Recently, it is listed as a type of thermocouple in international standards.
Various parameters of nickel silicon are as follows:
Chemical composition: Si: 4.3%, Mg: 0.1%, and the rest is Ni
Resistance: 0.365 Ω mm2 / M
Resistance temperature coefficient (20-100 ° C) 689x10 negative 6th power / K
Coefficient of thermal expansion (20-100 ° C) 17x10 negative 6th power / K
Thermal conductivity (100 ° C) 27xwm negative power 1 K negative power 1
Melting point: 1420 ° C
1. Among semiconductor materials, silicon is the most widely used. A variety of metal silicides have been studied and used in the contact and interconnection technology of semiconductor devices. MoSi2, WSI and nisi2 have been successively introduced into the development of microelectronic devices. These silicon-based films have good matching with the silicon material itself, and can be used for insulation, isolation, passivation and interconnection in silicon devices,
2. The nickel silicide formation process has low silicon consumption and low formation heat budget, low resistivity and no linewidth effect Therefore, Nisi, as the most promising self-aligned silicide material for nano-sized devices, has attracted extensive attention and research
3. In graphene electrode, nickel silicide can delay the pulverization and cracking of silicon electrode and improve the conductivity of electrode.
4. Wetting and spreading effects of nisi2 alloy on SiC ceramics at different temperatures and atmospheres.