Ni2Si Nickel Silicide
  • Ni2Si Nickel SilicideNi2Si Nickel Silicide
  • Ni2Si Nickel SilicideNi2Si Nickel Silicide

Ni2Si Nickel Silicide

Haixin is one of the leading and professional Ni2Si Nickel Silicide manufacturers in China. Providing you with good after-sales service and quick delivery, we warmly welcome you to high quality Ni2Si Nickel Silicide at the most competitive price with us.

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Product Description

Chemical formula: Ni2Si

Molecular weight: 145.472

CAS No.: 12059-14-2

MDL No.: MFCD00151367

EINECS No. 235-033-1

Density: 7.4g/cm3

Melting point: 1255 ℃

Resistance temperature coefficient (20-100 ° c) 689x10 minus 6th power/k

Coefficient of thermal expansion (20-100 ° c) 17x10 to the minus 6th power/k

Thermal conductivity (100 ° c) 27xwm minus 1st power K minus 1st power

Properties: nickel silicide is rapidly soluble in hydrofluoric acid, slowly soluble in hydrochloric acid, and insoluble in water. Nickel silicide reacts violently with fluorine at room temperature to white heat, and reacts with chlorine at red heat. Nickel silicide decomposes in aqua regia.

Preparation method: heating silicon oxide, nickel oxide (II) and aluminum in blast furnace.

Application: nickel silicon is austenitic (NiSi) alloy; It is the material used as the negative terminal of the N-type thermocouple. It has good thermoelectric stability above 1000 ℃, and better oxidation resistance than E, J and K type electric couples.

Nickel silicide is a kind of intermetallic nickel silicon compound. Nickel silicides are important in microelectronics because they form in nickel silicon junctions. The thin layer of nickel silicide can also be used to improve the surface resistance of nickel alloys.

Nickel silicide is a promising substitute material for silicide because of its low resistivity, low silicon consumption and low formation temperature. Nickel silicide has recently become an ideal electrical contact material for the source, drain and gate of complementary metal oxide silicon devices, and has shown good scaling performance. Nickel silicide is very important in microelectronic devices because it is a good conductor, and the conductivity of NiSi is similar to that of the element nickel. When nickel reacts with silicon carbide as a semiconductor at high temperature, nickel silicide and carbon will be formed. Due to its corrosion resistance, oxidation resistance and wear resistance, nickel silicide has the potential to be used as nickel base superalloy and stainless steel coating. The application of NiSi as unsaturated hydrocarbon hydrogenation catalyst was studied. Silicon dioxide supported nickel silicide nanoparticles have been proposed as a widely used alternative catalyst for spontaneous combustion of Raney nickel.

Packaging and storage: The product is packed in inert gas filled plastic bags, sealed and stored in a dry and cool environment. It should not be exposed to the air to prevent moisture and oxidation agglomeration, which will affect the dispersion performance and use effect; The number of packages can be provided according to the customer's requirements.

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