Ni2Si Nickel Silicide
Silicon (NiSi) is an austenitic (NiSi) alloy (1); it is used as the negative pole material of n-type
thermocouple. Its thermoelectric stability is better than that of E, J and K type electric couple.
Nickel silicon alloy should not be placed in sulfur-containing gas. Recently, it is listed as a type
of thermocouple in international standard.
The parameters of NiSi are as follows:
Chemical composition: Si: 4.3%, Mg: 0.1%, the rest is Ni
Resistance: 0.365 Ω mm2 / M
Resistance temperature coefficient (20-100 ° C) 689x10 minus 6th power / K
Coefficient of thermal expansion (20-100 ° C) 17x10 minus 6th power / K
Thermal conductivity (100 ° C) 27xwm negative first power K negative first power
Melting point: 1420 ° C
Silicon is the most widely used semiconductor materials. A variety of metal silicides have been
studied for contact and interconnection technology of semiconductor devices. MoSi2, WSI and
Ni2Si have been introduced into the development of microelectronic devices. These silicon-based
thin films have good matching with silicon materials, and can be used for insulation, isolation,
passivation and interconnection in silicon devices,NiSi, as the most promising self-aligned silicide
material for nanoscale devices, has been widely studied for its low silicon loss and low formation
heat budget, low resistivity and no linewidth effect In graphene electrode, nickel silicide can delay
the occurrence of pulverization and cracking of silicon electrode, and improve the conductivity of
the electrode.The wetting and spreading effects of nisi2 alloy on SiC ceramics at different
temperatures and atmospheres were investigated.